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More than ten years of successful experience in CNC research and development, with independent and controllable control over the entire process. Master the equipment’s core controller from the ground up.
Implement system construction starting from the underlying code, support secondary development in all dimensions, and allow for independent and deep customization of multi axis motion logic and servo parameters
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Persist in positive research and development, and control independent intellectual property rights. Reach new heights beyond established global technical leaders.
Based on more than ten years of equipment research and development experience, we are actively designing hardware modules for the entire machine, independently developing coupling heads and core components for high-pressure pumps, and supporting scenario customization and optimization.
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Benchmarked against world-leading technologies, we further refine targeted metrics, and surpass global brands on key targeted parameters.
Exceeding imported brands in one or two key indicators such as cutting quality, cutting efficiency, and nozzle lifespan, achieving differentiated competition
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Based on core underlying technologies, expandable to 5-axis and peripheral automation, with fast adaptation & upgrades across diverse scenarios.
Support 5-axis expansion, integration of loading and unloading production lines, and expansion of multi material process packages, which can be customized and modified according to the semiconductor/aviation/hardware industries
Why Choose Us?
We are the Technology-Driven Company in the Water Guided Laser Industry
Products and Services
Water Guided Laser Processing Equipment
Green (532 nm) Water Guided Laser Cutting Machining System can be used for cutting, drilling, grooving and engraving.
Infrared (1064 nm) Water Guided Laser Cutting Machining System is dedicated to materials.
Custom Services
Customize 5-axis, fixture, software and other functions in depth according to the customers’ requirements.
News
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Water Guided Laser Breaks Through Diamond-Copper Machining Challenges
Traditional copper and copper-alloy thermal management materials are approaching their performance limits. Diamond-copper composites, combining ultra-high thermal conductivity, a coefficient of thermal expansion compatible with semiconductor substrates, and lightweight characteristics, are emerging as a promising material for advanced thermal management.2026-07-06
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Exhibition Review | Watlaser participated in The 3rd Diamond Materials Technology for the Semiconductor Industry Conference
Watlaser participated in the event with its Water Guided Laser diamond processing solutions, engaging with industry experts and professionals to explore advances in diamond heat-spreader processing and the future of diamond materials in semiconductor applications.2026-09-05
Industry Solutions
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Non-thermal-damage machining for blades & composite components, improving part durability
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Micron-level cutting of SiC, diamond copper; minimal chipping, stable yield
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Precision cutting of titanium alloy implants with smooth surfaces for human implantation
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Machining electrode sheets & ceramic packages, preventing thermal deformation to protect battery cells
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Machining hard-to-cut precision molds, balancing accuracy, surface quality and mass production efficiency
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Micro-nano sample preparation for advanced material Research and Development
Partners
Through deep collaboration with leading universities, research institutions, and industry leaders, we serve diverse fields including semiconductors, aerospace, precision cutting tools, and high-end manufacturing. By combining academic research with industrial practice, we jointly tackle Water-Guided Laser precision machining technology, continuously refining high-stability, high-precision production equipment solutions.
Watlaser Technology develops and manufactures Water Guided Laser systems for precision machining of advanced materials. With in-house expertise in CNC systems, optical coupling, fluid control, and core hardware, Watlaser provides high-precision processing solutions for semiconductor, diamond, aerospace, medical, and industrial applications.