Semiconductor

Diamond-doped tungsten-based materials are typical difficult-to-machine composite materials used in industrial manufacturing. They combine the extreme hardness of diamond with the high density of a tungsten-based matrix.

Watlaser Water Guided Laser technology enables precision processing of this type of composite material while minimizing diamond particle pull-out and thermal damage.

Processing Performance

· Diamond particle size: ≥ 300 μm

· Dimensional error: within 20 μm

· No diamond particle pull-out

· Processing time: only 1/20 of the conventional process

Diamond-silicon carbide (Diamond-SiC) composites combine the exceptionally high thermal conductivity of diamond with the low thermal expansion, high specific stiffness, and excellent heat and corrosion resistance of silicon carbide.

Their favorable thermal expansion compatibility makes them promising materials for power semiconductor packaging, semiconductor heat spreaders, and optical mirror substrates. However, both diamond and silicon carbide are extremely hard and brittle. Their differences in hardness make interfacial machining challenging, often leading to selective material removal and particle pull-out, rapid tool wear, and low processing efficiency.

Watlaser Water Guided Laser technology enables precision machining of diamond-SiC composite blocks measuring 10 × 10 mm with a thickness of 4.3 mm. The process produces flat cutting surfaces with no edge chipping, while minimizing particle pull-out at the cutting edges. No visible thermal damage or microcracks were observed, helping meet the surface-quality requirements for semiconductor packaging.

Thin-walled SiC components are particularly sensitive to mechanical stress and thermal damage during machining.

Watlaser Water Guided Laser technology enables precise cutting of thin SiC structures while minimizing cracking and edge chipping.

Processing Example

· Wall thickness: 100 μm

· No visible cracking

· No edge chipping

· Thickness error: ≤ 10 μm

Silicon carbide (SiC) is a key advanced ceramic material used in aerospace applications. Its high hardness and brittleness make conventional micro-hole machining challenging. Watlaser Water Guided Laser technology enables precision machining of SiC with high dimensional accuracy while minimizing edge chipping and thermal damage.

Application Example

· Material thickness: 4.2 mm

· Hole diameter: 600 μm

· Dimensional error: < 5 μm

· Processing efficiency improved by approximately 40%

The result is a clean, precise micro-hole with excellent edge quality.