Semiconductor

Silicon carbide (SiC) is a key third-generation semiconductor material. With a Mohs hardness of approximately 9, SiC is extremely hard and brittle, making conventional machining challenging. Traditional diamond wire cutting can result in relatively low processing efficiency, edge chipping, and reduced surface quality.

Watlaser Water Guided Laser technology provides a non-contact cutting solution that minimizes thermal damage and edge breakage while improving processing efficiency.

Processing Example

· Inner diameter: 1 mm; Outer diameter: 2 mm; Height: 20 mm

· High-quality cylindrical cutting

· Improved processing efficiency compared with conventional diamond wire cutting

Thin-walled SiC components are particularly sensitive to mechanical stress and thermal damage during machining.

Watlaser Water Guided Laser technology enables precise cutting of thin SiC structures while minimizing cracking and edge chipping.

Processing Example

· Wall thickness: 100 μm

· No visible cracking

· No edge chipping

· Thickness error: ≤ 10 μm

Diamond is one of the most promising materials for advanced semiconductor thermal management due to its extremely high thermal conductivity.

However, its high hardness and brittleness make precision machining of microchannel structures extremely challenging. Conventional machining methods can easily cause cracking, poor surface quality, and dimensional inconsistency.

Watlaser Water Guided Laser technology enables precision machining of diamond microchannels with minimal material damage.

Processing Example

· Surface roughness: Ra ≤ 1 μm

· Microchannel width/depth consistency error: ≤ 15 μm

· No visible cracking after machining

· High-quality microchannel structures