Diamond
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For small-sized diamond, nanosecond laser processing is generally used. As the size of synthetic diamond grows larger, the traditional nanosecond laser processing efficiency is low and the disadvantage of large loss is becoming more and more obvious.
Water-guided laser technology, by confining the laser in the water column, it can realize the precision machining of diamond with high efficiency and low loss.
Diamond, as the highest hardness material in nature, compared with other materials, puts forward the highest requirements for the key technical indicators of water guide laser equipment, such as coupling accuracy, consumable life and stability. Single-cut depth, it is a symbol of the core indicators of the ability of water-guided laser processing diamond.
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Lengchen's self-developed water-conductive laser technology has been able to achieve a cutting depth of 20mm for diamond single blade and a cutting depth of 40mm for turning over. According to public information, it has reached the leading level in China. At the same time, the single-blade 30mm deep cutting technology is also being developed. |
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Can also be cut thin. Recently, Lengchen has successfully made a diamond chip with a thickness of only 100μm for customers, with a cross-sectional size of 10*10mm, which is the first time in the industry according to public information. |
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At present, the size of diamond slices produced by cold Chen batch stability is 50*30mm. |
