Silicon Carbide
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Silicon carbide has been widely used in the new energy industry. At the same time, due to its high hardness (Mohs hardness is 9), the traditional diamond wire cutting method shows the disadvantages of large loss and poor cutting quality.
The quality of the cut surface of silicon carbide processed by water-guided laser can generally meet customer requirements. At the same time, to replace the existing process in silicon carbide processing, water-guided laser must do two things: |
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| 1. High efficiency. Water guide laser equipment is currently expensive, only to achieve high enough cutting efficiency, faster than the existing processing technology, it is possible to make the water guide laser equipment become competitive. Watlaser Technology has continuously improved its design, optimized for silicon carbide cutting, and continuously improved the cutting efficiency of silicon carbide, which has made water-guided laser equipment economical in some silicon carbide processing processes; |
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2. Stability. Silicon carbide processing often requires a lot of holes or graphics on the same part, and the processing time of a single part is long, which requires the stability of the equipment. Lengchen Technology borrows its experience in diamond cutting, has a more stable nozzle life, and continues to function at breakpoints after accidental suspension, all of which can obtain better stability.
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Silicon Carbide AR Lens Cutting Watlaser Technology Water Guide Laser is specially designed for depth adjustment of silicon carbide AR lens: single cutting is only 3 minutes and 38 seconds, thermal damage <10μm, chipping edge <15μm, and size error <18μm. Compared with traditional cutting, it solves the problem of edge chipping and thermal damage, and redefines the processing standard of silicon carbide optical lenses with high precision, low damage and easy cleaning. |
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