Exhibition Review | Watlaser participated in 2026 Copper Composite Developers Forum.
The 2026 Copper Composite Developers Forum was successfully held in Ningbo, Zhejiang, from August 24 to 26.
Watlaser Technology, offering the solutions for Cu-diamond composites Processing participated in 2026 Copper Composite Developers Forum.
During the event, Watlaser engaged with industry experts, researchers, and representatives from leading companies to explore new possibilities for high-precision Cu-diamond composites processing.
Throughout the forum, Watlaser's booth attracted significant attention from experts and industry professionals.
Discussions focused on key challenges in Cu-diamond composites processing, including:
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Cutting surface quality
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Thick-section cutting capability
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Processing stability
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Thin-sheet cutting
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Dimensional accuracy
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Production efficiency
Representatives from research institutes and companies spoke positively about Watlaser's processing capabilities and expressed interest in further technical cooperation.
Advanced Water Guided Laser Processing for Cu-diamond composites
At the event, Watlaser demonstrated its Water Guided Laser processing technology for Cu-diamond composites materials.
With enhanced cutting depth, improved stability, and reliable long-duration operation, the solution is designed for continuous processing and covers a wide range of Cu-diamond composites applications.
Key Processing Capabilities
20+ mm
Single-pass cutting depth
Ø30 mm
Stable cutting of Cu-diamond composites discs
0.02 mm
Thickness difference controlled within 0.02 mm for a 30 mm diameter Cu-diamond composites wafer
These capabilities enable efficient processing of thick Cu-diamond composites materials for high-power semiconductor applications, while Watlaser has also accumulated extensive process experience in cutting thin sheets with different diamond particle sizes.
This helps address challenges such as deformation during thin-sheet processing.
Figure: Comparison of cutting surfaces between Watlaser's Cu-diamond composites processing and routine processing methods.
Figure: Ø30 mm Cu-diamond composites alloy wafer with thickness difference controlled within 0.02 mm.
With stable equipment performance, extensive process expertise, and continuous technological development, Watlaser helps customers overcome critical processing challenges in diamond-based materials.
By combining advanced Water Guided Laser technology with application-specific process development, Watlaser is committed to enabling high-efficiency, high-precision, and high-yield production for advanced manufacturing applications.
