Exhibition Preview | Watlaser to Exhibit at 2026 Copper Composite Materials Developer Forum
From August 24 to 26, the 2026 Copper Composite Materials Developer Forum will be held in Ningbo, Zhejiang. Watlaser Technology (Shanghai) will be exhibiting at Booth C18, showcasing a full-scenario Water Guided Laser processing solution for diamond-copper materials. We warmly invite you to join us on-site.
Watlaser Technology: Redefining Diamond-Copper Processing Standards with Water Guided Laser
Diamond-copper is a next-generation star material for high-end thermal management, yet it poses extreme processing challenges — diamond particle pullout, thermal damage leading to performance failure, insufficient thick-sheet cutting capability, and the lack of mature solutions for complex microchannel fabrication. Centered on Water Guided Laser technology, Watlaser Technology has continuously refined its processes for diamond-copper cutting, delivering a complete solution that enables diamond-copper to transition from the laboratory to mass production.
High-energy laser light is coupled into a high-pressure fine water jet, precisely acting on the cutting zone. The water jet provides real-time cooling while carrying away heat, resulting in an extremely small heat-affected zone. Through three generations of process iteration, diamond pullout has been virtually eliminated while maintaining a smooth cutting surface — ensuring both thermal conductivity and structural integrity.
Image: Watlaser's diamond-copper processing VS conventional processing
Single-pass cutting depth reaches over 20 mm, with stable cutting of round sheets up to 30 mm in diameter — meeting the thick-sheet diamond-copper processing demands of high-power devices. Additionally, Watlaser has accumulated extensive process expertise in cutting thin sheets with diamond particles of varying sizes, solving the core challenge of thin-sheet deformation.
Image: Diamond-copper alloy thin sheet, 30 mm diameter
Microchannel liquid cooling represents the next frontier in thermal management, and integrated diamond-copper microchannel fabrication remains largely uncharted territory in the industry. Watlaser Technology has already initiated precision microchannel machining process R&D, reserving next-generation core processing capabilities for partner customers and seizing both technological and market advantages ahead of the curve.
Equipped with Watlaser's patented coupling technology and proprietary nozzle manufacturing processes, this system delivers deeper cutting capability and greater stability, making it ideal for long-duration continuous processing applications — covering the vast majority of diamond-copper processing requirements. We welcome you to visit us on-site for technical specifications and processing case studies.
Image: Watlaser Green (532nm) Water Guided Laser processing equipment
Backed by reliable equipment performance, mature process expertise, and continuous technological iteration, Watlaser Technology Co., Ltd. empowers customers to overcome processing bottlenecks, achieve high-efficiency, high-precision, high-yield mass production of diamond-copper components, and jointly drive the upgrade of high-end industries.
Welcome to Visit Watlaser Technology
Booth C18
