Silicon Carbide

Cilicon carbide has been widely used in the new energy industry. At the same time, due to its high hardness (Mohs hardness is 9), the traditional diamond wire cutting method shows the disadvantages of large loss and poor cutting quality.

To replace the existing process in silicon carbide processing, the water guided laser must do three points.

2.High efficiency. Water guide laser equipment is currently expensive, only to achieve high enough cutting efficiency, faster than the existing processing technology, it is possible to make the water guide laser equipment become competitive;

Diagram shows 100 μm thick silicon carbide ring machining

3. Stability. Silicon carbide processing often requires many holes or graphics on the same part, and the processing time of a single part is long, which puts forward higher requirements for equipment stability. Watlaser Technology borrows its experience in diamond cutting, has a more stable nozzle life, and continues to function at breakpoints after accidental suspension, all of which can obtain better stability.

Figure shows eight-inch silicon carbide ingot rounded

Watlaser Technology continues to improve its design, which is specially optimized for silicon carbide cutting and continuously improves the cutting efficiency of silicon carbide, which has made water-guided laser become economical in some silicon carbide processing processes;

Diagram shows a silicon carbide cylinder with an inner diameter of 1mm, an outer diameter of 2mm and a height of 20mm. In the processing of this part, Watlaser Technology's water-guided laser has been able to achieve faster cutting speed and better cutting surface quality than diamond wire.

1.Cutting quality. Compared with traditional cutting, water-guided laser solves the problems of edge chipping and thermal damage, and redefines the processing standard of silicon carbide optical lenses with high precision, low damage and easy cleaning.

Diagram shows a silicon carbide AR lens, which is cut by a water-guided laser of Lengchen Technology. The thermal damage is less than 10μm, the chipping edge is less than 15μm, and the size error is less than 18μm.