Diamond

For small-sized diamond, nanosecond laser processing is generally used. With the longer the size of synthetic diamond, the traditional nanosecond laser processing has low efficiency, large loss and large taper.

water-guided laser technology, by confining the laser in the water column, it can realize the precision machining of diamond with high efficiency, low loss and almost no taper.

Diamond, as the highest hardness material in nature, compared with other materials, puts forward the highest requirements for the key technical indicators of water guide laser equipment, such as coupling accuracy, consumable life and stability. Single-cut depth, it is a symbol of the core indicators of the ability of water-guided laser processing diamond.

Watlaser 's self-developed water-conductive laser technology has been able to achieve a cutting depth of 20mm for diamond single blade and a cutting depth of 40mm for turning over. According to public information, it has reached the leading level in China. At the same time, the single-blade 30mm deep cutting technology is also being developed according to the market rhythm.

Can also be cut thin. Recently, Lengchen has successfully made a diamond chip with a thickness of only 100μm for customers, with a cross-sectional size of 10*10mm, which is the first time in the industry according to public information.